Samsung to boost US chip capacity with 7.2 billion investment in advanced packaging

Samsung plans a significant 7.2 billion dollar investment in US chip facilities focused on advanced packaging to support 2-nanometer and 4-nanometer chip production. The move aims to expand end to end manufacturing covering fabrication packaging and memory and to attract new clients such as Apple and Tesla. Taylor Fab 1 is nearing completion with full readiness by year end and equipment installation next year. This follows prior scaled back plans and seeks to mitigate tariff and demand pressures.